説明
Primary Uses - Aluminum oxide Tin oxide Titanium oxide Zinc oxide構成
-single-chamber -no load lock -Thermal chamber (no plasma), with an ozone generator. -Includes pump and transformer -PC was just upgraded -New MFC was installed recently Sources: Hot: TDMA-Sn H20 DEZ TiCl4 TMA O3OEMモデルの説明
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.ドキュメント
ドキュメントなし
BENEQ
TFS 200
カテゴリ
ALD
最終検証： 25日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
150901
ウェーハサイズ：
不明
ヴィンテージ：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Primary Uses - Aluminum oxide Tin oxide Titanium oxide Zinc oxide構成
-single-chamber -no load lock -Thermal chamber (no plasma), with an ozone generator. -Includes pump and transformer -PC was just upgraded -New MFC was installed recently Sources: Hot: TDMA-Sn H20 DEZ TiCl4 TMA O3OEMモデルの説明
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.ドキュメント
ドキュメントなし