During fiscal 1999, Applied Materials purchased the remaining 50 percent of Applied Komatsu Technology, Inc. (AKT) that it did not previously own. 
AKT supplies equipment  for fabricating flat panel displays (FPDs) that are used in notebook PCs, desktop monitors, TVs and other applications. 

The Applied Materials AKT1600 is a panel etcher and panel deposition tool with four loading ports, two vacuum load locks, and five chambers. Two chambers (A and B) are designated for etching, processing a maximum of two panels at a time. Etch Chamber A is used primarily for etching silicon nitrate (SiN) while Etch Chamber B is used to etch aluminum (Al), molybdenum (Mo), indium tin oxide (ITO) and amorphous silicon (a-Si). The three deposition chambers are single panel chambers. Chamber D is used to deposit SiN and a-Si. Chamber C is used to deposit material doped n-type and chamber E to deposit materials doped p-type although both chambers can also deposit un-doped amorphous silicon. The AKT 1600 plasma enhanced chemical vapor deposition (PECVD) system is a powerful vacuum system used to convert reactive gaseous species into a solid film. With its advanced capabilities and versatility, the AKT 1600 PECVD system is an essential tool for the fabrication of high-quality solar cells.

APPLIED MATERIALS (AMAT) / APPLIED KOMATSU TECH (AKT)

1600 PECVD

NEW ARISTO 1800

AKT-NEW ARISTO™ 1200L (1200mm x 1600mm)

NEW ARISTO 1200L

VMU-01A1

3500 PECVD

AKT-50K PECVD(2,160mm x 2,460mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

50K PECVD

AKT-25K PECVD(1,500mm x 1,850mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

25K PECVD

AKT-10K PECVD(1,000mm x 1,200mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

10K PECVD

AKT-55K PECVD(2,200mm x 2,500mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

55K PECVD

AKT-5500 PECVD(730mm x 920mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

500 PECVD

AKT-4300 PECVD(620mm x 750mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers


4300 PECVD

AKT-NEW ARISTO™ 1400L (1400mm x 1600mm)
Color Filter Sputtering systems deposit conductive and reflective film on color filter substrate for flat panel display.

NEW ARISTO 1400L

AKT-NEW ARISTO™ 2200S (1950mm x 2250mm)
Color Filter Sputtering systems deposit conductive and reflective film on color filter substrate for flat panel display.

NEW ARISTO 2200S

AKT-NEW ARISTO™ 2200M (2250mm x 2500mm) 
Color Filter Sputtering systems deposit conductive and reflective film on color filter substrate for flat panel display.

NEW ARISTO 2200M

AKT-NEW ARISTO™ 1400 (1250mm x 1300mm)
Color Filter Sputtering systems deposit conductive and reflective film on color filter substrate for flat panel display.

NEW ARISTO 1400

AKT-NEW ARISTO™ 1800L (1870mm x 2200mm)
Color Filter Sputtering systems deposit conductive and reflective film on color filter substrate for flat panel display.

NEW ARISTO 1800L

The NEW ARISTO™ 1200 is a color filter sputtering system that deposits conductive and reflective film on color filter substrates for flat panel displays. It has a size of 1100mm x 1200mm. This system is designed to improve the quality and performance of flat panel displays. 

NEW ARISTO 1200 

AKT-1600 EBT(360mm x 465mm)
E-Beam Array Testers provide fast, cost-effective ways to find and identify defective pixels on large-area substrates

1600 EBT

AKT-5500 EBT(730mm x 920mm)
E-Beam Array Testers provide fast, cost-effective ways to find and identify defective pixels on large-area substrates

5500 EBT

AKT-4300 EBT(620mm x 750mm)
E-Beam Array Testers provide fast, cost-effective ways to find and identify defective pixels on large-area substrates

4300 EBT

AKT-3500 EBT(550mm x 650mm)
E-Beam Array Testers provide fast, cost-effective ways to find and identify defective pixels on large-area substrates

3500 EBT

AKT-55K EBT(2,200mm x 2,500mm)
E-Beam Array Testers provide fast, cost-effective ways to find and identify defective pixels on large-area substrates.

55K EBT

AKT-40K EBT(1,950mm x 2,250mm)
E-Beam Array Testers provide fast, cost-effective ways to find and identify defective pixels on large-area substrates.

40K EBT

AKT-25K EBT(1,500mm x 1,850mm)
E-Beam Array Testers provide fast, cost-effective ways to find and identify defective pixels on large-area substrates.

25K EBT

AKT-20K PECVD(1,300mm x 1,500mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

20K PECVD

AKT-15K PECVD(1,200mm x 1,300mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

15K PECVD

AKT-40K PECVD(1,950mm x 2,250mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

APPLIED MATERIALS (AMAT) / APPLIED KOMATSU TECH (AKT)

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VMU-01A1

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