The goal is to develop and produce advanced and innovative vapor phase reflow soldering systems and to offer our customers a simple and high quality soldering process in the process. Vapor as an energy transfer medium is one of the most effective methods for heating assemblies. The efficiency is many times higher than, for example, heating by convection. 

Optionally, the system can be equipped with the patented Multi Vacuum technology. A vacuum module that can be switched on during the process reduces the voids in the solder joints and is extremely low-maintenance. The vacuum module can be retrofitted.

ASSCON

VP800 vacuum

ASSCON Vapour-Phase-Reflow-Soldering Systems set the benchmark in soldering technology. The physical laws of the process permit defect-free soldering of the most complicated SMT assemblies in any required geometry even when using lead-free solder pastes.Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed with very high quality results. The QUICKYSeries is designed to be used in the laboratory and for prototype production.

QUICKY450

Stand-Alone system for flexible production. With flexibly loadable workpiece carriers and a maximum solder size of 600 x 600 mm, this system is ideally suited for both small and large product volumes.

 VP6000 vacuum

Due to the very compact design, particularly suitable for users who process applications with frequently changing products in the small series range. Due to the universal application possibilities, the systems can also be used very well in prototyping and laboratory as well as for process qualifications.

VP800

The VP800 basic is the entry-level model in the VP800 series. Due to their very compact design, the systems of the VP800 series are particularly suitable for users who process applications with frequently changing products in small batches. Due to the universal application possibilities, the systems can also be used very well in prototyping and laboratory as well as for process qualification.

VP800basic

The soldering chamber has been enlarged to 750 x 620 mm. Both smaller assemblies up to a load of four in the batch and larger assemblies up to the maximum size of the soldering chamber can be processed.

VP2100-100

ASSCON vapor phase reflow soldering systems set standards in soldering technology. The VP7000 vacuum inline systems are based on advanced patented high-tech soldering methods, and offer outstanding soldering quality in large series production. 

VP7000-200

With an enlarged soldering chamber of up to 1,500 mm, a significantly higher throughput is possible. Alternatively, assemblies with a maximum length of up to 1,500 mm can also be soldered.

VP2000-310

The compact unit was developed for use in the laboratory and for special applications. It is particularly suitable for test soldering, for qualification of the soldering process and for the soldering of sample assemblies.

VP310

The VP510 was developed for use in the laboratory and for special applications. Due to its compact design and an optionally integrable cooling system, it is ready for use anywhere and without preparation, even at changing locations. Only a 240V main connection is required for operation. The system is particularly suitable for test soldering, for qualification of the soldering process and for soldering sample assemblies. Due to the semi-automatic operation, the system can also be used for one-off production.

 VP510

ASSCON’s Vapor-Phase Reflow Soldering Systems set the benchmark in soldering technology. The physical laws of the process permit the defect-free soldering of the most complicated SMT assemblies in any required geometry even when using leadfree solder pastes. Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed with highest quality results. The vapor-phase soldering machines of the QUICKY series are designed for the laboratory and for prototype productions.

QUICKY300

With a maximum solder length of 1,200 mm and a maximum width of 520 mm, it is ideally suited for all types of soldering jobs. At the same time, the system remains very compact in its dimensions.

VP2000-210

Optionally, the system can be equipped with the patented Multi Vacuum technology. A vacuum module that can be switched on during the process reduces the voids in the solder joints and is extremely low in maintenance. The vacuum module can also be retrofitted.

VP2100-100 vacuum

Stand-Alone system for flexible production. With flexibly loadable workpiece carriers and a maximum solder size of 610 x 610 mm, this system is ideally suited for both small and large product volumes.

VP1000-66

The VP450 Series is designed to be used in the laboratory and for prototype production. Due to its compact design the machine may be used at any place and without preparatory set-up even at different workplaces. With an integrated closed cooling system installed only a 240 V / 120 V supply connection is required to operate the unit.

VP450

A dual lane transport enables maximum throughputs. Cycle times of up to 20 seconds per assembly are achievable. An asymmetrical transport system for oversized assemblies is optionally available.

ASSCON

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