Novellus acquired Gasonics in 2001. Novellus now offers a suite of advanced photoresist strip and clean products. 

PEP 3510C is a dry chemistry downstream processing system manufactured by GaSonics. It is designed for photoresist removal in the fabrication of ICs with feature sizes of 0.25 microns and below. The system incorporates the Company’s proprietary microwave downstream processing technology and has a throughput rate ranging from approximately 45 to 55 wafers per hour, depending upon wafer size and customer application.

LAM RESEARCH / NOVELLUS / GASONICS 

PEP 3510C

The G400 and GxT are based on the production-proven, market-leading GAMMA platform. Targeted for bulk strip and high-dose implant strip (HDIS) applications, the GxT, is designed for critical logic device manufacturing process steps that demand low silicon loss and ultra-low defectivity.

GAMMA GxT

The G400 and GxT are based on the production-proven, market-leading GAMMA platform. Targeted for bulk strip and high-dose implant strip (HDIS) applications, the G400 is the industry’s most productive ashing system, with throughputs of over 400 wafers-per-hour. 

GAMMA G400

15-336373-00

**PARTS**

L3300

The PEP 3510Plus is a sophisticated system designed for the damage-free removal of photoresist. It is a dual chamber microwave downstream photoresist removal system that uses a combination of platen and lamp wafer heating to achieve high strip rates, resulting in high throughput. This production-proven system is commonly used for bulk photoresist removal and descum applications. Its advanced technology ensures efficient and effective photoresist removal.

PEP 3510plus

7100

The SIERRA system is an advanced dry-clean system for 300mm wafer manufacturing processes. It delivers photoresist and residue removal for today’s most advanced applications. The SIERRA system is designed specifically to address the intricate cleaning challenges associated with the industry’s migration to copper metallization and low-k dielectrics. It yields significantly higher capital productivity and significantly lower cost-of-ownership advantages than competing dry-clean systems.

SIERRA

AE-2001

HiPOx

GaSonics VHP high-pressure oxidation system.

L2200

The GAMMA Express, introduced in 2006, is a high productivity resist strip system designed to meet the technology requirements for 45 nanometer manufacturing. GAMMA Express performs high dose implant strip (HDIS) and incorporates non-oxidizing processes for advanced silicides and low-k dielectric films. The redesigned GAMMA Express platform offers a new direct-drive wafer handling subsystem, as well as a new high ash rate source.

GAMMA EXPRESS

PEP3510A is a dry chemistry downstream processing system for photoresist removal, manufactured by GaSonics. It incorporates the company’s proprietary microwave downstream processing technology and is designed for advanced IC manufacturers. The system can handle feature sizes of 0.25 microns and below, with throughput rates ranging from approximately 45 to 55 wafers per hour.

L3510

The Aura 1000 is an advanced dry chemistry processing system for photoresist removal, manufactured by GaSonics. It incorporates the company’s proprietary microwave downstream processing technology and is designed to be used in the fabrication of ICs with feature sizes of 0.25 microns and below. The system provides a lower cost of ownership solution for advanced IC manufacturers and has a throughput rate ranging from approximately 45 to 55 wafers per hour, depending on wafer size and customer application.

A1000 

The GAMMA 2130 system is a front-end-of-line (FEOL) photoresist strip system for 300mm wafers. Our multi-station sequential processing architecture incorporates six stations within a single process chamber, enabling a 30 percent higher throughput rate when compared to that of the closest competitor.

GAMMA 2130

PEP IRIDIA DL

PEP 4800DL

PEP 3510A

A2000

GAMMA xPR

STRATA

The PEP IRIDIA is an advanced cleaning system designed for sub-0.18-micron 200mm wafer applications. The IRIDIA’s modular architecture allows manufacturers to configure the system for both front and back-end-of-line cleaning applications down to 90 nanometer device geometries. Targeted at critical steps in copper and low-k manufacturing processes, the IRIDIA offers the highest productivity of any 200mm dry-clean system currently on the market.

PEP IRIDIA

Gasonics/IPC: Aura 3000, downstream rrucrowave asher, 60 wafers per hour, 8-inch capable.

A3000

The GAMMA 2100 200mm photoresist removal system uses a plasma source to strip photoresist. The GAMMA architecture features a multi-station sequential processing design with six strip stations, resulting in high wafer throughput with a minimal number of critical subsystems.

GAMMA 2100

9104

L3200

L3500

The Aura 3010 is an enhancement to the Aura 3000.

A3010

The G3D is a version of the GxT platform designed for advanced wafer-level packaging applications, including contact clean and TSV photoresist strip.

LAM RESEARCH / NOVELLUS / GASONICS

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PEP 3510C

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15-336373-00

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