PICOSUN

Morpher

he PICOSUN® P-300BV ALD system is specially designed for production of LEDs, discrete devices, and MEMS devices such as print heads, sensors, and microphones.

P-300BV

P-300F

SUNALE R-150

PICOSUN Morpher F ALD product platform is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables fast, fully automatic, high throughput production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

Morpher F

The PICOSUN® Sprinter ALD system is designed to disrupt batch ALD production in 300 mm manufacturing lines in the semiconductor (e.g. emerging memory, transistor, capacitor), display, and IoT component industries. In Sprinter, barrier, high-k oxide, and other films are deposited with perfect ALD in mass production volumes.

Sprinter

The PICOSUN® P-1000 ALD system is designed for batch coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants.

P-1000

The PICOSUN® P-300B ALD system is specially designed for production of MEMS devices such as print heads, sensors, and microphones, and coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants.

P-300B

PICOSUN® Morpher T single wafer ALD system is designed to answer the requirements when quality, control and yield come before anything else, for the 200 mm wafer industries.  It also enables an enhanced process window for demanding production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

Morpher T

R-200

The P-200 ALD tool is specifically optimized for fast and efficient manufacturing of MEMS (MicroElectroMechanical Systems, e.g. sensors and actuators), LEDs (Light-Emitting Diodes), and power electronics components.

PICOSUN™ P-200 ALD tool is designed for wafer size 150 mm or 200 mm in batch of 25 wafers. The cornerstones of Picosun ALD system design – unmatched versatility, modularity, and flexibility – are manifested in the variety of automation options available for the P-200 tool: The system can be equipped with a linear inline loader, it can be operated with an industrial robot, connected to a vacuum robot, or integrated with a vacuum load lock, glove box, or mini clean environment. 

P-200

PICOSUN® P PEALD (Plasma Enhanced Atomic Layer Deposition) system is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables an enhanced process window for demanding production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

PICOSUN

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Morpher

P-300BV

P-300F

SUNALE R-150

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