説明
説明なし構成
Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mmOEMモデルの説明
Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.ドキュメント
ドキュメントなし
カテゴリ
AOI
最終検証： 11日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
152851
ウェーハサイズ：
不明
ヴィンテージ：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA FUSION 300
カテゴリ
AOI
最終検証： 11日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
152851
ウェーハサイズ：
不明
ヴィンテージ：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mmOEMモデルの説明
Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.ドキュメント
ドキュメントなし