ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



iHAWK Xtreme

The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.

EAGLE 60AP

The Eagle 60 is a wire bonder from ASM that is capable of ultra-fine pitch bonding for advanced ball grid array (BGA) devices.

EAGLE 60

ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.

ISLinDA

The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.

EAGLE XTREME

AB559A

 The ASMPT EAGLE XTREME GOCU is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME die bonder that offers additional features and capabilities.

EAGLE XTREME GOCU

AB339

The ASM iHAWK-V bonders are advanced semiconductor bonding machines developed by ASM Assembly Systems, a division of ASM Pacific Technology Ltd. These bonders are specifically designed for high-precision and high-throughput semiconductor assembly processes.

iHAWK-V

ISEAGLE XTREME

iHAWK

The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate

IS868LA2

HARRIER

The ASM MCM12 Die Sorter is a machine developed by ASM Pacific Technology, a leading supplier of semiconductor assembly and packaging equipment. The MCM12 Die Sorter is designed specifically for the sorting and handling of semiconductor dies, which are individual integrated circuit components that are separated from a wafer during the semiconductor manufacturing process.

MCM12

TWIN EAGLE

IS8912DA

iHAWK Xtreme GoCu

The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.

Eagle AERO

NOVA Plus

iHAWK Xpress GoCu

The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.

EAGLE XPRESS GOCU

The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.

TWIN EAGLE XTREME

AB339 EAGLE

The ASM Harrier Xtreme is a dual head platform bonder used in the semiconductor industry.

HARRIER  XTREME

AB520A

TWIN EAGLE XTREME GoCu

EAGLE 60XL

AB559

Rotary Head Fine Aluminum Wire Bonding System

AB589

AB520

AB530

Eagle AERO GoCu

HUMMINGBIRD

AL512

The ASM IS868-LA3 is a die sorter machine used in the semiconductor industry for sorting semiconductor chips

ASM

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EAGLE 60

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