説明
Details attached.構成
10kN Force, Max Temp 500°COEMモデルの説明
The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.ドキュメント
EVGroup (EVG)
EVG520IS
検証済み
カテゴリ
Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
14447
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG520IS
カテゴリ
Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
14447
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available