We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 続きを読む
EVG805
カテゴリ
Bonder/Debonder概要（Overview）
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
