説明
説明なし構成
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.OEMモデルの説明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.ドキュメント
ドキュメントなし
EVGroup (EVG)
EVG805
検証済み
カテゴリ
Bonder/Debonder
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
55578
ウェーハサイズ：
不明
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
カテゴリ
Bonder/Debonder
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
55578
ウェーハサイズ：
不明
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.OEMモデルの説明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.ドキュメント
ドキュメントなし