説明
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm (6"setting) Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding構成
構成なしOEMモデルの説明
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).ドキュメント
ドキュメントなし
EVGroup (EVG)
EVG810 LT
検証済み
カテゴリ
Bonders
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
98353
ウェーハサイズ:
8"/200mm
ヴィンテージ:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示EVGroup (EVG)
EVG810 LT
カテゴリ
Bonders
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
98353
ウェーハサイズ:
8"/200mm
ヴィンテージ:
2009
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm (6"setting) Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding構成
構成なしOEMモデルの説明
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).ドキュメント
ドキュメントなし