説明
FC-150 Flip Chip Bonder 50KG bond pressure構成
構成なしOEMモデルの説明
Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracyドキュメント
ドキュメントなし
SUSS MicroTec / KARL SUSS
FC-150
検証済み
カテゴリ
Bonders
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
82532
ウェーハサイズ：
不明
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
FC-150
カテゴリ
Bonders
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
82532
ウェーハサイズ：
不明
ヴィンテージ：
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
FC-150 Flip Chip Bonder 50KG bond pressure構成
構成なしOEMモデルの説明
Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracyドキュメント
ドキュメントなし