SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components.

SUSS MicroTec / KARL SUSS

Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy

Flip Chip Bonder

FC-150

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SUSS MicroTec / KARL SUSS

FC-150

Flip Chip Bonders

同様のリスト

SUSS MicroTec / KARL SUSS

FC-150

SUSS MicroTec / KARL SUSS

FC-150

SUSS MicroTec / KARL SUSS

FC-150

SUSS MicroTec / KARL SUSS

FC-150

FC-150

Flip Chip Bonders

同様のリスト

SUSS MicroTec / KARL SUSS

FC-150

SUSS MicroTec / KARL SUSS

FC-150

SUSS MicroTec / KARL SUSS

FC-150

SUSS MicroTec / KARL SUSS

FC-150