説明
Product Details SUSS FC 150 Flip Chip Bonder - 100 KG bond pressure - 20Amps - 220V, 60Hz Optional equipment installed: - Chip Flipper - Automatic Alignment (Cognex 8000) - Advanced Laser Leveling - Universal Bonding Arm (UBA) - High Precision SET Reflow Arm (SRA) - Force Sensor in Stage - This tool powers on, launches software and completes initialization process (tool reset) - 1999 Vintage *** We have one more non-working FC-150, Vintage 2000, which will be added to this sale (all inclusive in the pricing above) ***構成
構成なしOEMモデルの説明
Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy Flip Chip Bonderドキュメント
ドキュメントなし
カテゴリ
Flip Chip Bonders
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
131734
ウェーハサイズ：
6"/150mm
ヴィンテージ：
1999
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
SUSS MicroTec / KARL SUSS
FC-150
カテゴリ
Flip Chip Bonders
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
131734
ウェーハサイズ：
6"/150mm
ヴィンテージ：
1999
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Product Details SUSS FC 150 Flip Chip Bonder - 100 KG bond pressure - 20Amps - 220V, 60Hz Optional equipment installed: - Chip Flipper - Automatic Alignment (Cognex 8000) - Advanced Laser Leveling - Universal Bonding Arm (UBA) - High Precision SET Reflow Arm (SRA) - Force Sensor in Stage - This tool powers on, launches software and completes initialization process (tool reset) - 1999 Vintage *** We have one more non-working FC-150, Vintage 2000, which will be added to this sale (all inclusive in the pricing above) ***構成
構成なしOEMモデルの説明
Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy Flip Chip Bonderドキュメント
ドキュメントなし