説明
説明なし構成
構成なしOEMモデルの説明
The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).ドキュメント
ドキュメントなし
SHINKAWA
SPA 300 SUPER
検証済み
カテゴリ
Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
84237
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SHINKAWA
SPA 300 SUPER
カテゴリ
Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
84237
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).ドキュメント
ドキュメントなし