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SHINKAWA UTC 1000 SUPER
    説明
    Wire Bonder
    構成
    構成なし
    OEMモデルの説明
    The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
    ドキュメント

    ドキュメントなし

    SHINKAWA

    UTC 1000 SUPER

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    検証済み

    カテゴリ
    Bonders

    最終検証: 30日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    101436


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明

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    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
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    同様のリスト
    すべて表示
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Bonders
    ヴィンテージ: 2005状態: 中古
    最終確認60日以上前

    SHINKAWA

    UTC 1000 SUPER

    verified-listing-icon
    検証済み
    カテゴリ
    Bonders
    最終検証: 30日以上前
    listing-photo-b628b45973ca43ceaba2585645e57fda-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    101436


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    Wire Bonder
    構成
    構成なし
    OEMモデルの説明
    The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Bondersヴィンテージ: 2005状態: 中古最終検証: 60日以上前
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Bondersヴィンテージ: 0状態: 中古最終検証: 30日以上前
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Bondersヴィンテージ: 0状態: 中古最終検証: 60日以上前