説明
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.構成
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEMモデルの説明
提供なしドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
SYNAPSE
検証済み
カテゴリ
Bonders
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
44844
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
検証済み
カテゴリ
Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
44844
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.構成
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEMモデルの説明
提供なしドキュメント
ドキュメントなし