説明
説明なし構成
CD SEM – Stage performance resolution = 1nm (xy) / 4nm (z) with 2µm accuracy – Image resolution = 1.8nm @ 500eV – Side wall imaging = 12 deg tilt at 4 directions – HAR imaging = 1:30 features – Accelerating voltage = 0.2kV to 2.5kV – Extraction V up to 4KV, Probe current = 5pA – 500pA – 4 wafer cassette loading portsOEMモデルの説明
The Applied VeritySEM 2 Metrology system offers unparalleled precision and maximum production throughput, measuring 45nm gate, low-k, and ArF resist features with 3Å accuracy, essential for 45nm device production. Enhanced by its advanced automation, this system drastically reduces the need for tool operators and cuts down on CD-SEM tools in fabs. A standout feature, the OPC Check, automates the Optical Proximity Correction mask qualification, catering to evolving chipmaker needs. Proprietary SEM technology ensures speedy electron movement and precise measurements, resulting in top-notch resolution.ドキュメント
ドキュメントなし
APPLIED MATERIALS (AMAT)
VeritySEM 2
検証済み
カテゴリ
CD-SEM
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
42944
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
APPLIED MATERIALS (AMAT)
VeritySEM 2
カテゴリ
CD-SEM
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
42944
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
CD SEM – Stage performance resolution = 1nm (xy) / 4nm (z) with 2µm accuracy – Image resolution = 1.8nm @ 500eV – Side wall imaging = 12 deg tilt at 4 directions – HAR imaging = 1:30 features – Accelerating voltage = 0.2kV to 2.5kV – Extraction V up to 4KV, Probe current = 5pA – 500pA – 4 wafer cassette loading portsOEMモデルの説明
The Applied VeritySEM 2 Metrology system offers unparalleled precision and maximum production throughput, measuring 45nm gate, low-k, and ArF resist features with 3Å accuracy, essential for 45nm device production. Enhanced by its advanced automation, this system drastically reduces the need for tool operators and cuts down on CD-SEM tools in fabs. A standout feature, the OPC Check, automates the Optical Proximity Correction mask qualification, catering to evolving chipmaker needs. Proprietary SEM technology ensures speedy electron movement and precise measurements, resulting in top-notch resolution.ドキュメント
ドキュメントなし