説明
Dielectric CMP構成
構成なしOEMモデルの説明
MIRRA® MESA CMP 200MM Applied Mirra CMP provides production-proven, high performance 150mm and 200mm planarization solutions for Silicon, shallow trench isolation (STI), oxide, polysilicon, tungsten and copper damascene applications. Its high-speed planarizing platens and multi-zone polishing heads enable superior uniformity and efficiency with low downforce. The integrated post-CMP Mesa cleaner, also available for 150mm and 200mm, effectively removes slurry, preventing residue formation and minimizing particles and water marks. For copper damascene applications, the 200mm Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying is also an option. The Applied Mirra CMP system also has options of multiple endpoint methods, in-line metrology and advanced process control capabilities that deliver excellent within-wafer and wafer-to-wafer process control and repeatability for all planarization applications. UPGRADES Advanced polishing technologies like Applied Materials’ Titan Profiler (150mm) and Titan Contour (200mm) head products and multi-platen configurations provide the ability to meet key uniformity metrics by tuning removal rates across the wafer surface and to within 3mm of the wafer edge, and are upgrade options for existing tools. These advance capabilities and other released upgrades provide additional processing capabilities that achieve higher throughput and yield.ドキュメント
ドキュメントなし
APPLIED MATERIALS (AMAT)
MIRRA DESICA
検証済み
カテゴリ
CMP
最終検証： 16日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116371
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
MIRRA DESICA
カテゴリ
CMP
最終検証： 16日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116371
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Dielectric CMP構成
構成なしOEMモデルの説明
MIRRA® MESA CMP 200MM Applied Mirra CMP provides production-proven, high performance 150mm and 200mm planarization solutions for Silicon, shallow trench isolation (STI), oxide, polysilicon, tungsten and copper damascene applications. Its high-speed planarizing platens and multi-zone polishing heads enable superior uniformity and efficiency with low downforce. The integrated post-CMP Mesa cleaner, also available for 150mm and 200mm, effectively removes slurry, preventing residue formation and minimizing particles and water marks. For copper damascene applications, the 200mm Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying is also an option. The Applied Mirra CMP system also has options of multiple endpoint methods, in-line metrology and advanced process control capabilities that deliver excellent within-wafer and wafer-to-wafer process control and repeatability for all planarization applications. UPGRADES Advanced polishing technologies like Applied Materials’ Titan Profiler (150mm) and Titan Contour (200mm) head products and multi-platen configurations provide the ability to meet key uniformity metrics by tuning removal rates across the wafer surface and to within 3mm of the wafer edge, and are upgrade options for existing tools. These advance capabilities and other released upgrades provide additional processing capabilities that achieve higher throughput and yield.ドキュメント
ドキュメントなし