説明
Litho構成
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEMモデルの説明
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.ドキュメント
ドキュメントなし
SUSS MicroTec / KARL SUSS
ACS200 Gen3
検証済み
カテゴリ
Coaters & Developers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Idle
製品ID：
111541
ウェーハサイズ：
不明
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
SUSS MicroTec / KARL SUSS
ACS200 Gen3
カテゴリ
Coaters & Developers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Idle
製品ID：
111541
ウェーハサイズ：
不明
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Litho構成
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEMモデルの説明
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.ドキュメント
ドキュメントなし