説明
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe構成
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEMモデルの説明
提供なしドキュメント
ドキュメントなし
APPLIED MATERIALS (AMAT)
UVISION 200
検証済み
カテゴリ
Defect Inspection
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
113572
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
UVISION 200
カテゴリ
Defect Inspection
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
113572
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe構成
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEMモデルの説明
提供なしドキュメント
ドキュメントなし