説明
Defect_Inspection(BF)構成
構成なしOEMモデルの説明
Using deep ultraviolet (DUV) laser-based technology, defects can be detected on patterned wafers (wafers with printed circuit images) as they move between processing steps. Defects include particles, open circuit lines, and shorts between lines. The Applied UVision 6 wafer inspection system detects yield-limiting defects in the critical patterning layers of logic and memory devices. The UVision® 6 system, featuring the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system further enhances defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications down to the 1xnm node, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers.ドキュメント
ドキュメントなし
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120690
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
APPLIED MATERIALS (AMAT)
UVISION 6
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120690
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Defect_Inspection(BF)構成
構成なしOEMモデルの説明
Using deep ultraviolet (DUV) laser-based technology, defects can be detected on patterned wafers (wafers with printed circuit images) as they move between processing steps. Defects include particles, open circuit lines, and shorts between lines. The Applied UVision 6 wafer inspection system detects yield-limiting defects in the critical patterning layers of logic and memory devices. The UVision® 6 system, featuring the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system further enhances defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications down to the 1xnm node, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers.ドキュメント
ドキュメントなし