説明
IQC構成
構成なしOEMモデルの説明
Wafer inspection. Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers. n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracyドキュメント
ドキュメントなし
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120320
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
UVISION 8
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120320
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
IQC構成
構成なしOEMモデルの説明
Wafer inspection. Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers. n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracyドキュメント
ドキュメントなし