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説明
Film Thickness Measurement System構成
構成なしOEMモデルの説明
SpectraFx 100 is KLA-Tencor’s next-gen thin film metrology solution that meets the process control requirements for 90nm devices, including 193nm DUV lithography processes. It supports next-gen and “operator-free” 300mm fabs with advanced automation and tool-to-tool matching capabilities, reducing process development time for advanced materials and accelerating their adoption into volume production. It also enables extensive product wafer monitoring and characterization required to accurately measure advanced thin films. It fully supports SEMI requirements for communication to automation tracks and materials process flow, delivering the precision, stability, and matching required for advanced thin film-measurement applications for 90nm device production. It achieves exceptional tool-to-tool matching and enables the use of a small spot size on product wafers, eliminating the use of monitor wafers.ドキュメント
ドキュメントなし
検証済み
カテゴリ
Defect Inspection
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
106455
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
SPECTRAFX 100
カテゴリ
Defect Inspection
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
106455
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Film Thickness Measurement System構成
構成なしOEMモデルの説明
SpectraFx 100 is KLA-Tencor’s next-gen thin film metrology solution that meets the process control requirements for 90nm devices, including 193nm DUV lithography processes. It supports next-gen and “operator-free” 300mm fabs with advanced automation and tool-to-tool matching capabilities, reducing process development time for advanced materials and accelerating their adoption into volume production. It also enables extensive product wafer monitoring and characterization required to accurately measure advanced thin films. It fully supports SEMI requirements for communication to automation tracks and materials process flow, delivering the precision, stability, and matching required for advanced thin film-measurement applications for 90nm device production. It achieves exceptional tool-to-tool matching and enables the use of a small spot size on product wafers, eliminating the use of monitor wafers.ドキュメント
ドキュメントなし