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LAM RESEARCH / NOVELLUS INOVA
    説明
    説明なし
    構成
    Ti-A1 Physical Vapor Deposition Machine
    OEMモデルの説明
    The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.
    ドキュメント

    ドキュメントなし

    LAM RESEARCH / NOVELLUS

    INOVA

    verified-listing-icon

    検証済み

    カテゴリ
    Deposition

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    75594


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    Deposition
    ヴィンテージ: 2012状態: 中古
    最終確認60日以上前

    LAM RESEARCH / NOVELLUS

    INOVA

    verified-listing-icon
    検証済み
    カテゴリ
    Deposition
    最終検証: 60日以上前
    listing-photo-e8a3414fc4ae4d72b722ecefecfab3c1-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    75594


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    Ti-A1 Physical Vapor Deposition Machine
    OEMモデルの説明
    The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    Depositionヴィンテージ: 2012状態: 中古最終検証:60日以上前
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    Depositionヴィンテージ: 1999状態: 中古最終検証:60日以上前
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    Depositionヴィンテージ: 2012状態: 中古最終検証:60日以上前