We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 続きを読む
説明
Included Components: -EFEM with Three Load Ports -Main Body Part No: TRT-TMZZ -Chamber Part No: TEX-061 (Qty. 4) -Transformer Box: 3M80-001940-13 (Qty. 2) -Power Distribution Part No: MB-G2AAAA構成
TEL Tokyo Electron Triase+ 300mm CVD ASFD TiN Process System Load Ports: 3 Process: ASFD TiN Software: V5.650R1OEMモデルの説明
The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates.ドキュメント
ドキュメントなし
カテゴリ
Deposition
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
114272
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
TRIASe+ EX-II TiN
カテゴリ
Deposition
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
114272
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Included Components: -EFEM with Three Load Ports -Main Body Part No: TRT-TMZZ -Chamber Part No: TEX-061 (Qty. 4) -Transformer Box: 3M80-001940-13 (Qty. 2) -Power Distribution Part No: MB-G2AAAA構成
TEL Tokyo Electron Triase+ 300mm CVD ASFD TiN Process System Load Ports: 3 Process: ASFD TiN Software: V5.650R1OEMモデルの説明
The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates.ドキュメント
ドキュメントなし