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説明
Specially designed for advanced IC and discrete packages,AD8312 provides a high speed automatic epoxy die bonding solution for alround IC and discrete applications. The high speed bonding performance and ecellent accuracy of ±1 mil@ 3 σ and MS Windows@ operating system makes AD8312 a perfect fit for your IC and discrete assembly solution.構成
構成なしOEMモデルの説明
The newly developed ASM Die Bonder AD8312 offers a wide range of benefits with the sole target of producing highest speed and quality at lowest cost per die placement. Special handling and operating aspects of stacked and thin die are incorporated in the revolutionary machine concept. The extremely fast vision system and the ultra-light pick and place head with his innovative linear motor technology offer an incredible increase in performance, product quality and yield.ドキュメント
ドキュメントなし
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ASM
AD8312
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79141
ウェーハサイズ：
不明
ヴィンテージ：
不明
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説明
Specially designed for advanced IC and discrete packages,AD8312 provides a high speed automatic epoxy die bonding solution for alround IC and discrete applications. The high speed bonding performance and ecellent accuracy of ±1 mil@ 3 σ and MS Windows@ operating system makes AD8312 a perfect fit for your IC and discrete assembly solution.構成
構成なしOEMモデルの説明
The newly developed ASM Die Bonder AD8312 offers a wide range of benefits with the sole target of producing highest speed and quality at lowest cost per die placement. Special handling and operating aspects of stacked and thin die are incorporated in the revolutionary machine concept. The extremely fast vision system and the ultra-light pick and place head with his innovative linear motor technology offer an incredible increase in performance, product quality and yield.ドキュメント
ドキュメントなし