説明
Die bonder構成
構成なしOEMモデルの説明
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.ドキュメント
ドキュメントなし
ASM
AD8312FC
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
65365
ウェーハサイズ：
不明
ヴィンテージ：
2015
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Available
Money Back Guarantee
Available
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Refurbishment Services
Available
説明
Die bonder構成
構成なしOEMモデルの説明
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.ドキュメント
ドキュメントなし