説明
standard 12" wafe flip chip bonder configuration, conditional very good構成
slot magazine (pick head )onload, flip chip module ,slot offload, standard configurationOEMモデルの説明
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.ドキュメント
ドキュメントなし
ASM
AD8312FC
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
59681
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
AD8312FC
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
59681
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
standard 12" wafe flip chip bonder configuration, conditional very good構成
slot magazine (pick head )onload, flip chip module ,slot offload, standard configurationOEMモデルの説明
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.ドキュメント
ドキュメントなし