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説明
ASM 838L LAYER TRANSFER_PLATELET FOR COMPACT CMCL sub asset: MDS 3200A-CA MICRODISPENSINGSYSTEM構成
構成なしOEMモデルの説明
The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.ドキュメント
ドキュメントなし
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ASM
AD838L
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120455
ウェーハサイズ：
不明
ヴィンテージ：
不明
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説明
ASM 838L LAYER TRANSFER_PLATELET FOR COMPACT CMCL sub asset: MDS 3200A-CA MICRODISPENSINGSYSTEM構成
構成なしOEMモデルの説明
The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.ドキュメント
ドキュメントなし