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ASM TWIN832
  • ASM TWIN832
  • ASM TWIN832
  • ASM TWIN832
説明
ASM Twin832P DIE BOND
構成
構成なし
OEMモデルの説明
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.
ドキュメント

ドキュメントなし

verified-listing-icon

検証済み

カテゴリ
Die Bonders / Sorters / Attachers

最終検証: 24日前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

123923


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ASM

TWIN832

verified-listing-icon
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 24日前
listing-photo-d0447f60f23f4fbdb58c72bdb40ed5a0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

123923


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
ASM Twin832P DIE BOND
構成
構成なし
OEMモデルの説明
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.
ドキュメント

ドキュメントなし