説明
説明なし構成
構成なしOEMモデルの説明
ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.ドキュメント
ドキュメントなし
BESI / ESEC
2007 HS
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
94781
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2007 HS
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
94781
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.ドキュメント
ドキュメントなし