説明
The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 um. Optionally, the accuracy can even be improved, down to 15 um. Minimal distances between pick and bond positions coupled with the stiff symmetrical bond head and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder Esec 2100 xPplus.構成
構成なしOEMモデルの説明
The Fastest 12" Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.ドキュメント
ドキュメントなし
BESI / ESEC
2100 xP plus
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79188
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 xP plus
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79188
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 um. Optionally, the accuracy can even be improved, down to 15 um. Minimal distances between pick and bond positions coupled with the stiff symmetrical bond head and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder Esec 2100 xPplus.構成
構成なしOEMモデルの説明
The Fastest 12" Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.ドキュメント
ドキュメントなし