We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 続きを読む
説明
説明なし構成
構成なしOEMモデルの説明
The 2200 apm+ is a die bonder from Datacon that is designed for advanced packaging with flip chip and die attach technologies. It can handle wafers of up to 300 mm and dies of up to 50 mm. The machine has a placement accuracy of 10µm@3s, making it suitable for handling the most demanding packages, including optoelectronic components. The 2200 apm+ is also capable of handling flip chip and die attach in one module, making it a versatile and flexible solution for advanced packaging. The machine is fully integrated into Datacon’s platform concept, allowing it to be combined with other line components such as stack loaders, Epoxy Writers, or the 2200 apm die bonder. This means that customers can tailor their production lines to their specific needs. The 2200 apm+ also has a range of accessories available, including wafer mapping, dispense units, gripper indexers, offline programming, and magazine handlers. Despite its advanced capabilities, the 2200 apm+ is operator-friendly and easy to use. Training times are short and reject rates are kept to a minimum. Users who have worked with the 2200 apm will find the transition to the 2200 apm+ seamless, as all software options are available on both machines.ドキュメント
ドキュメントなし
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
69299
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示PREFERRED
SELLER
BESI / DATACON
2200 APM+
Die Bonders / Sorters / Attachersヴィンテージ： 2004状態： 中古
最終確認60日以上前
PREFERRED
SELLER
BESI / DATACON
2200 APM+
Die Bonders / Sorters / Attachersヴィンテージ： 2005状態： 中古
最終確認60日以上前
BESI / DATACON
2200 APM+
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
69299
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The 2200 apm+ is a die bonder from Datacon that is designed for advanced packaging with flip chip and die attach technologies. It can handle wafers of up to 300 mm and dies of up to 50 mm. The machine has a placement accuracy of 10µm@3s, making it suitable for handling the most demanding packages, including optoelectronic components. The 2200 apm+ is also capable of handling flip chip and die attach in one module, making it a versatile and flexible solution for advanced packaging. The machine is fully integrated into Datacon’s platform concept, allowing it to be combined with other line components such as stack loaders, Epoxy Writers, or the 2200 apm die bonder. This means that customers can tailor their production lines to their specific needs. The 2200 apm+ also has a range of accessories available, including wafer mapping, dispense units, gripper indexers, offline programming, and magazine handlers. Despite its advanced capabilities, the 2200 apm+ is operator-friendly and easy to use. Training times are short and reject rates are kept to a minimum. Users who have worked with the 2200 apm will find the transition to the 2200 apm+ seamless, as all software options are available on both machines.ドキュメント
ドキュメントなし