説明
No missing parts構成
* Multi-chip module - Flip chip and die attach tasks can be executed in just one module * Small footprint - 2200 evo only requires 1,4 m2 of (clean room) floor space * Key specifications Die handling from 0,17 mm - 50 mm, Placement accuracy of ±10 µm @ 3s (cmk = 1,33) * Operator friendly - Despite the wide range of fittings and set-up options, the operation of the 2200 EVO is easy to learn - just as used for the 2200 platform. Date a transfer via TCP/IP networks is naturally implemented, and the user interface is menu-driven. Flexibility - Even the standard module of the 2200 EVO die bonders can be very variably equipped. * Slide flux is not included * Heated options - Heated bond head (up to 350 °C) and substrate heating (up to 150 °C) are available to convert today's and tomorrow's demands of heat-requiring applications.OEMモデルの説明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.ドキュメント
BESI / DATACON
2200 EVO
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
89162
ウェーハサイズ：
不明
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
BESI / DATACON
2200 EVO
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
89162
ウェーハサイズ：
不明
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available