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説明
Powered-on testing is available.構成
構成なしOEMモデルの説明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.ドキュメント
PREFERRED
SELLER
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 30日以上前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
New
稼働ステータス:
不明
製品ID：
124096
ウェーハサイズ：
不明
ヴィンテージ：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
PREFERRED
SELLER
BESI / DATACON
2200 EVO
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 30日以上前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
New
稼働ステータス:
不明
製品ID：
124096
ウェーハサイズ：
不明
ヴィンテージ：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available