
説明
Automatic Die Bonder Newer Used in Prodcution Die Attach, Flip Chip & Multi-Chip Capability Upgraded Camera Upgraded Image Processing Unit Large Format Heated Stage Thermal Compensation Open Platform Architecture構成
構成なしOEMモデルの説明
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.ドキュメント
ドキュメントなし
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
129666
ウェーハサイズ:
不明
ヴィンテージ:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / DATACON
2200 EVO plus
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
129666
ウェーハサイズ:
不明
ヴィンテージ:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Automatic Die Bonder Newer Used in Prodcution Die Attach, Flip Chip & Multi-Chip Capability Upgraded Camera Upgraded Image Processing Unit Large Format Heated Stage Thermal Compensation Open Platform Architecture構成
構成なしOEMモデルの説明
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.ドキュメント
ドキュメントなし