説明
説明なし構成
構成なしOEMモデルの説明
High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stressesドキュメント
ドキュメントなし
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
133517
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FASFORD
DB830plus+
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
133517
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stressesドキュメント
ドキュメントなし