説明
Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1690 Accessories Completeness - Main machine +IUPC loading and unloading構成
Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)OEMモデルの説明
Die Bonderドキュメント
ドキュメントなし
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 昨日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
153371
ウェーハサイズ：
不明
ヴィンテージ：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
INFOTECH AUTOMATION
IC-1600
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 昨日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
153371
ウェーハサイズ：
不明
ヴィンテージ：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1690 Accessories Completeness - Main machine +IUPC loading and unloading構成
Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)OEMモデルの説明
Die Bonderドキュメント
ドキュメントなし