![MECH-EL 703](https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1116/e2e72db15d0547a4abe51b7ba5a4371f/40150074ffe04058b742a83765d30c7d_14c4c6f32a6c44d6959659aaa1338dca1201a_lw.jpeg)
説明
Includes: New touch screen with recipes Timed parameters: pre scrub, scrub and post scrub times Temperatures : work holder, tip and power output to hot gas heater Scrub frequency Can be programmed to hold bond head down for variable amount of time Emergency release button for bond head構成
Mechel 709/703 hot gas bonderOEMモデルの説明
The Mech-El/MEI 703 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 703 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.ドキュメント
ドキュメントなし
MECH-EL
703
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
60952
ウェーハサイズ:
不明
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MECH-EL
703
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
60952
ウェーハサイズ:
不明
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Includes: New touch screen with recipes Timed parameters: pre scrub, scrub and post scrub times Temperatures : work holder, tip and power output to hot gas heater Scrub frequency Can be programmed to hold bond head down for variable amount of time Emergency release button for bond head構成
Mechel 709/703 hot gas bonderOEMモデルの説明
The Mech-El/MEI 703 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 703 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.ドキュメント
ドキュメントなし