MI20
概要（Overview）
Mi20 is a full specification platform designed for wafer to reel process in WLCSP. Below are the key features of Mi20: • Provides throughput up to 20,000 UPH • Handles 12" wafer or below • Ability to handle die size of 0.3 x 0.3 mm or larger
現在の掲載品
2
サービス
検査、保証、鑑定、ロジスティクス
