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説明
Automatic placement machine Details attached構成
構成なしOEMモデルの説明
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.ドキュメント
ドキュメントなし
NEWPORT
MRSI 605
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
111925
ウェーハサイズ：
不明
ヴィンテージ：
2010
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Refurbishment Services
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説明
Automatic placement machine Details attached構成
構成なしOEMモデルの説明
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.ドキュメント
ドキュメントなし