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SHINKAWA SPA 300 SUPER
    説明
    DIE BONDER
    構成
    構成なし
    OEMモデルの説明
    The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).
    ドキュメント

    ドキュメントなし

    SHINKAWA

    SPA 300 SUPER

    verified-listing-icon

    検証済み

    カテゴリ
    Die Bonders / Sorters / Attachers

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    112835


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    SHINKAWA SPA 300 SUPER

    SHINKAWA

    SPA 300 SUPER

    Die Bonders / Sorters / Attachers
    ヴィンテージ: 2007状態: 中古
    最終確認60日以上前

    SHINKAWA

    SPA 300 SUPER

    verified-listing-icon
    検証済み
    カテゴリ
    Die Bonders / Sorters / Attachers
    最終検証: 60日以上前
    listing-photo-96da4887fd704f19a877429389fed036-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    112835


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    DIE BONDER
    構成
    構成なし
    OEMモデルの説明
    The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    SHINKAWA SPA 300 SUPER

    SHINKAWA

    SPA 300 SUPER

    Die Bonders / Sorters / Attachersヴィンテージ: 2007状態: 中古最終検証:60日以上前
    SHINKAWA SPA 300 SUPER

    SHINKAWA

    SPA 300 SUPER

    Die Bonders / Sorters / Attachersヴィンテージ: 0状態: 中古最終検証:30日以上前
    SHINKAWA SPA 300 SUPER

    SHINKAWA

    SPA 300 SUPER

    Die Bonders / Sorters / Attachersヴィンテージ: 0状態: 中古最終検証:60日以上前