説明
説明なし構成
Installed wafermap and barcode reader, can recognize XML.AWW and other wafermap format Bonding CapabilityOEMモデルの説明
Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.ドキュメント
ドキュメントなし
BESI / ESEC
2100 DS
検証済み
カテゴリ
Die Bonders
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
30490
ウェーハサイズ:
8"/200mm
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示BESI / ESEC
2100 DS
カテゴリ
Die Bonders
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
30490
ウェーハサイズ:
8"/200mm
ヴィンテージ:
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Installed wafermap and barcode reader, can recognize XML.AWW and other wafermap format Bonding CapabilityOEMモデルの説明
Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.ドキュメント
ドキュメントなし