説明
説明なし構成
Gripper type.Eutectic Die Bonder. Magazine to MagazineOEMモデルの説明
The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more. The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features: -A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications. -Minimized number of moving mechanical parts. -The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion. -Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.ドキュメント
ドキュメントなし
NEWPORT
MRSI 705
検証済み
カテゴリ
Die Bonders
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
107674
ウェーハサイズ：
不明
ヴィンテージ：
2014
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Logistics Support
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Money Back Guarantee
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Refurbishment Services
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同様のリスト
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NEWPORT
MRSI 705
カテゴリ
Die Bonders
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
107674
ウェーハサイズ：
不明
ヴィンテージ：
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Gripper type.Eutectic Die Bonder. Magazine to MagazineOEMモデルの説明
The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more. The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features: -A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications. -Minimized number of moving mechanical parts. -The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion. -Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.ドキュメント
ドキュメントなし