説明
Die Bonder構成
2200 evo Multichip Die bonderOEMモデルの説明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.ドキュメント
ドキュメントなし
BESI / DATACON
2200 EVO
検証済み
カテゴリ
Die Sorters & Attachers
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
102515
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
BESI / DATACON
2200 EVO
カテゴリ
Die Sorters & Attachers
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
102515
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Die Bonder構成
2200 evo Multichip Die bonderOEMモデルの説明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.ドキュメント
ドキュメントなし