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説明
説明なし構成
構成なしOEMモデルの説明
The AMAT CENTURA eMAX ETCH is an advanced dielectric etch system designed for fabricating semiconductor chip structures with feature sizes as small as 0.13 microns and beyond. It optimizes etching, photoresist strip, and barrier removal in a single chamber, reducing costs and cycle times. The system supports various applications, including etch, epitaxy, CVD, RTP, and plasma nitration. Its integration with existing Centura platforms allows for enhanced flexibility and adaptation to different process requirements. Introduced in June 2000, the eMAX ETCH specializes in etching a wide range of dielectric films, crucial for producing high-precision and reliable semiconductor devices in the contact and interconnect regions of chips. The Dielectric Etch eMax Centura was introduced in June 2000 as an extension of Applied's MxP+ and Super e dielectric process chamber designs. The Applied Centura eMax system etches a broad range of dielectric films in the contact and interconnect regions of the chip.ドキュメント
ドキュメントなし
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
119300
ウェーハサイズ：
8"/200mm
ヴィンテージ：
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA eMAX ETCH
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
119300
ウェーハサイズ：
8"/200mm
ヴィンテージ：
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The AMAT CENTURA eMAX ETCH is an advanced dielectric etch system designed for fabricating semiconductor chip structures with feature sizes as small as 0.13 microns and beyond. It optimizes etching, photoresist strip, and barrier removal in a single chamber, reducing costs and cycle times. The system supports various applications, including etch, epitaxy, CVD, RTP, and plasma nitration. Its integration with existing Centura platforms allows for enhanced flexibility and adaptation to different process requirements. Introduced in June 2000, the eMAX ETCH specializes in etching a wide range of dielectric films, crucial for producing high-precision and reliable semiconductor devices in the contact and interconnect regions of chips. The Dielectric Etch eMax Centura was introduced in June 2000 as an extension of Applied's MxP+ and Super e dielectric process chamber designs. The Applied Centura eMax system etches a broad range of dielectric films in the contact and interconnect regions of the chip.ドキュメント
ドキュメントなし