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APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
  • APPLIED MATERIALS (AMAT) CENTURA II
説明
説明なし
構成
AMAT Centura II - Frame and Controller only Primary and secondary rack Cardcage with backplane DC Power Filter box Gas box Does not include: Slot PCB (SBC, AIO, DIO) HDD FDD QOB CB (4) / 0190-00596 / MCE, common chamber tray (4) / 0010-01246 / VME2 Assembly, control, MCE (1) / 0010-01409 / Interlock assembly, gas panel, VME2, MCE.
OEMモデルの説明
"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."
ドキュメント

ドキュメントなし

カテゴリ
Dry / Plasma Etch

最終検証: 60日以上前

主なアイテムの詳細

状態:

Parts Tool


稼働ステータス:

不明


製品ID:

69660


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

CENTURA II

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検証済み
カテゴリ
Dry / Plasma Etch
最終検証: 60日以上前
listing-photo-b08b94fc5e5949cfb28ec19b95b6940a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2056/b08b94fc5e5949cfb28ec19b95b6940a/7d202ef8c9504bd7a6c2959c40310f17_a2249462470b48f88fb6167385fadacb_mw.png
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listing-photo-b08b94fc5e5949cfb28ec19b95b6940a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2056/b08b94fc5e5949cfb28ec19b95b6940a/26938cdb0f394000898278e3aec55c7b_aa133531b479459398a549d9dbb5af39_mw.png
listing-photo-b08b94fc5e5949cfb28ec19b95b6940a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2056/b08b94fc5e5949cfb28ec19b95b6940a/31a681182a0542e8be863acf43b6510b_62130e483f6f4abcbe4047652bc9ff39_mw.png
主なアイテムの詳細

状態:

Parts Tool


稼働ステータス:

不明


製品ID:

69660


ウェーハサイズ:

不明


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし
構成
AMAT Centura II - Frame and Controller only Primary and secondary rack Cardcage with backplane DC Power Filter box Gas box Does not include: Slot PCB (SBC, AIO, DIO) HDD FDD QOB CB (4) / 0190-00596 / MCE, common chamber tray (4) / 0010-01246 / VME2 Assembly, control, MCE (1) / 0010-01409 / Interlock assembly, gas panel, VME2, MCE.
OEMモデルの説明
"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."
ドキュメント

ドキュメントなし