説明
説明なし構成
Wafer EtchingOEMモデルの説明
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.ドキュメント
ドキュメントなし
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
129838
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
APPLIED MATERIALS (AMAT)
EMAX CT+ CHAMBER
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
129838
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Wafer EtchingOEMモデルの説明
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.ドキュメント
ドキュメントなし