説明
Sidewall etch, 32nanometer構成
1ch SiN: CHA, 3 loadportsOEMモデルの説明
The eMax chamber operates in a new process regime that distinguishes it from other medium density plasma systems and enables the precise, high-throughput etching of very small, deep features. The system's unique, tunable, magnetic confinement technology and cost-effective approach to controlling temperature allow the eMax chamber to achieve low particle levels and extended MWBC (mean wafers between clean) intervals, resulting in a significant advantage in system cost-of-ownership.The eMax chambers are available on Applied Materials' enhanced Etch Centura II multi-chamber platform, which features a dual blade robotic handling system for increased throughput. The eMax Centura II can be configured with up to four process chambers, allowing a significant operational cost advantage over more limited capacity three-chamber systems. eMax chambers also can be added to existing Centura and Centura II platforms.ドキュメント
ドキュメントなし
APPLIED MATERIALS (AMAT)
EMAX CT+
検証済み
カテゴリ
Dry / Plasma Etch
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
114043
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
APPLIED MATERIALS (AMAT)
EMAX CT+
カテゴリ
Dry / Plasma Etch
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
114043
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Sidewall etch, 32nanometer構成
1ch SiN: CHA, 3 loadportsOEMモデルの説明
The eMax chamber operates in a new process regime that distinguishes it from other medium density plasma systems and enables the precise, high-throughput etching of very small, deep features. The system's unique, tunable, magnetic confinement technology and cost-effective approach to controlling temperature allow the eMax chamber to achieve low particle levels and extended MWBC (mean wafers between clean) intervals, resulting in a significant advantage in system cost-of-ownership.The eMax chambers are available on Applied Materials' enhanced Etch Centura II multi-chamber platform, which features a dual blade robotic handling system for increased throughput. The eMax Centura II can be configured with up to four process chambers, allowing a significant operational cost advantage over more limited capacity three-chamber systems. eMax chambers also can be added to existing Centura and Centura II platforms.ドキュメント
ドキュメントなし